OCZ Xtreme Thermal Exchange and Blade 2 DDR3 Memory Series Debut |
Written by OCZ Technology Group, Inc. | ||
Tuesday, 23 November 2010 | ||
OCZ Xtreme Thermal Exchange and Blade 2 DDR3 Memory Series DebutHigh-Speed DDR3 with New Low-Profile Heatspreader Designs for Superior Passive CoolingOCZ Technology Group, Inc. (Nasdaq:OCZ), a leading provider of high-performance solid-state drives (SSDs) and memory modules for computing devices and systems, unveils new Xtreme Thermal Exchange (XTE) and Blade 2 high-speed desktop memory, providing the optimal balance of blazing DDR3 performance and cooling efficiency in one solution. Committed to staying ahead of the curve in the high performance segment of the memory market, OCZ is offering high-end memory that keeps pace with intensive overclocking, gaming, and other high-productivity computing environments.
"Building on our previous lines of enthusiast overclocking memory, the new XTE and Blade 2 DDR3 memory series are designed to set the benchmark once again and deliver the ultimate in performance and stability," said Alex Mei, CMO of OCZ Technology Group. "Featuring new compact, yet highly efficient heatspreader designs, these hand-tested kits are the ideal solution for overclockers gaming and productivity applications, and are optimized for the latest generation of platforms from Intel and AMD."
Developed for next generation platforms that take advantage of extreme speeds, OCZ XTE and Blade 2 solutions are the choice counterparts for leading-edge performance and reliability, meeting the demand for high-speed AMD AM3, Intel CoreTM i3, i5, and i7 processors. With an ideal combination of frequency and low latency, OCZ's latest 6GB and 4GB memory kits are specifically designed and qualified on a range of motherboards supporting enhanced clock speeds beyond typical JEDEC profiles.
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